Invention Grant
- Patent Title: Component mounting machine
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Application No.: US15755894Application Date: 2015-09-03
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Publication No.: US11266049B2Publication Date: 2022-03-01
- Inventor: Kazuma Hattori
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2015/075122 WO 20150903
- International Announcement: WO2017/037926 WO 20170309
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04 ; H05K13/02 ; H05K13/00 ; H05K3/30

Abstract:
There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.
Public/Granted literature
- US20190037742A1 COMPONENT MOUNTING MACHINE Public/Granted day:2019-01-31
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