Invention Grant
- Patent Title: Uplink transmission gaps in eMTC
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Application No.: US15593137Application Date: 2017-05-11
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Publication No.: US11265894B2Publication Date: 2022-03-01
- Inventor: Alberto Rico Alvarino , Peter Gaal , Hao Xu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson+ Sheridan, L.L.P.
- Main IPC: H04W72/04
- IPC: H04W72/04 ; H04W52/02 ; H04W24/08 ; H04W72/12 ; H04W74/08 ; H04W8/22 ; H04W4/70

Abstract:
Aspects of the present disclosure provide techniques and apparatus for uplink transmission gaps in enhanced machine type communications (eMTC). In one aspect, a method is provided which may be performed by a wireless device such as a user equipment (UE), which can be a low cost eMTC UE. The method generally includes transmitting a random access preamble, receiving a random access response in response to the random access preamble, transmitting an uplink message containing an indication of a capability of the UE to transmit using uplink gaps, and receiving signaling of configuration information regarding uplink gaps.
Public/Granted literature
- US20170339712A1 UPLINK TRANSMISSION GAPS IN EMTC Public/Granted day:2017-11-23
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