Invention Grant
- Patent Title: Microelectromechanical systems vibration sensor
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Application No.: US16844831Application Date: 2020-04-09
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Publication No.: US11265641B2Publication Date: 2022-03-01
- Inventor: Michael Pedersen , Venkataraman Chandrasekaran , Joshua Watson , Jeremy Johnson
- Applicant: Knowles Electronics, LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Loppnow & Chapa
- Agent Matthew C. Loppnow
- Main IPC: H04R1/10
- IPC: H04R1/10 ; B81B7/00 ; B81B3/00 ; H04R31/00 ; B81B7/02

Abstract:
A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.
Public/Granted literature
- US20200245053A1 MICROELECTROMECHANICAL SYSTEMS VIBRATION SENSOR Public/Granted day:2020-07-30
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