Invention Grant
- Patent Title: Modular connector with printed circuit board wafer to reduce crosstalk
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Application No.: US16830581Application Date: 2020-03-26
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Publication No.: US11264749B2Publication Date: 2022-03-01
- Inventor: Keith Edwin Miller , Albert Tsang , Scott Eric Walton , Eric Douglas Springston, II , Andrew M. Martin
- Applicant: TE Connectivity Services GmbH
- Applicant Address: CH Schaffhausen
- Assignee: TE Connectivity Services GmbH
- Current Assignee: TE Connectivity Services GmbH
- Current Assignee Address: CH Schaffhausen
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H01R12/73 ; H01R13/6587 ; H01R13/6586 ; H01R13/6476 ; H01R13/6473

Abstract:
A circuit board for use in a modular electrical connector. The circuit board has a first surface and an oppositely facing second surface. Signal pathways are provided on the first surface. The signal pathways have signal pathway ends abutting a mounting end of the circuit board. First ground pathways are provided on the first surface. The first ground pathways are positioned adjacent at least one of the signal pathways. The first ground pathways have first ground pathway ends abutting the mounting end of the circuit board. One or more second ground pathways are provided on the second surface. The one or more second ground pathways have second ground pathway ends abutting the mounting end of the circuit board. The positioning of the signal pathway ends, the first ground pathway ends and the second ground pathway ends abutting the mounting end reduces crosstalk between signal pairs.
Public/Granted literature
- US20210305737A1 MODULAR CONNECTOR WITH PRINTED CIRCUIT BOARD WAFER TO REDUCE CROSSTALK Public/Granted day:2021-09-30
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