Invention Grant
- Patent Title: LDMOS device and method for manufacturing same
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Application No.: US16657096Application Date: 2019-10-18
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Publication No.: US11264497B2Publication Date: 2022-03-01
- Inventor: Wensheng Qian
- Applicant: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
- Current Assignee: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
- Current Assignee Address: CN Shanghai
- Agency: MKG, LLC
- Priority: CN201910056315.0 20190122
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/40 ; H01L29/66 ; H01L21/265 ; H01L21/324

Abstract:
Disclosed is an LDMOS device comprising a drift region formed by a selected area of a doped layer of a first conductivity type on a semiconductor substrate, a gate structure comprising a gate dielectric layer and a gate conductive layer which are sequentially formed on a surface of the doped layer of the first conductivity type, a doped self-aligned channel region of a second conductivity type, and a doped layer formed by tilted ion implantation with a first side face of the gate structure as a self-alignment condition. A method for manufacturing an LDMOS device is further disclosed. The channel length is not affected by lithography and thus can be minimized to fulfill an ultralow specific-on-resistance, and the distribution uniformity of the channel length can be improved, so that the performance uniformity of the device is improved.
Public/Granted literature
- US20200235237A1 LDMOS DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2020-07-23
Information query
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