Invention Grant
- Patent Title: Light detecting element and method of manufacturing same
-
Application No.: US16463760Application Date: 2018-11-01
-
Publication No.: US11264420B2Publication Date: 2022-03-01
- Inventor: Yusuke Otake , Toshifumi Wakano
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2017-219685 20171115
- International Application: PCT/JP2018/040660 WO 20181101
- International Announcement: WO2019/098035 WO 20190523
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/369 ; H04N5/3745 ; H04N5/378

Abstract:
The present technology relates to a light detecting element and a method of manufacturing the same that make it possible to reduce pixel size. The light detecting element includes a plurality of pixels arranged in the form of a matrix. Each of the pixels includes a first semiconductor layer of a first conductivity type formed in an outer peripheral portion in the vicinity of a pixel boundary, and a second semiconductor layer of a second conductivity type opposite from the first conductivity type formed on the inside of the first semiconductor layer as viewed in plan. A high field region formed by the first semiconductor layer and the second semiconductor layer when a reverse bias voltage is applied is configured to be formed in a depth direction of a substrate. The present technology is, for example, applicable to a photon counter or the like.
Public/Granted literature
- US20210183917A1 LIGHT DETECTING ELEMENT AND METHOD OF MANUFACTURING SAME Public/Granted day:2021-06-17
Information query
IPC分类: