Invention Grant
- Patent Title: Packaged device carrier for thermal enhancement or signal redistribution of packaged semiconductor devices
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Application No.: US16680044Application Date: 2019-11-11
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Publication No.: US11264336B2Publication Date: 2022-03-01
- Inventor: Sreenivasan K. Koduri
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/495 ; H01L21/48 ; H01L23/14 ; H01L23/498
Abstract:
In a described example, an apparatus includes a packaged device carrier having a board side surface and an opposing surface, the packaged device carrier having conductive leads having a first thickness spaced from one another; the conductive leads having a head portion attached to a dielectric portion, a middle portion extending from the head portion and extending away from the board side surface of the packaged device carrier at an angle to the opposing surface, and each lead having an end extending from the middle portion with a foot portion configured for mounting to a substrate.
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Information query
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