Invention Grant
- Patent Title: Interconnection with side connection to substrate
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Application No.: US16585299Application Date: 2019-09-27
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Publication No.: US11264314B2Publication Date: 2022-03-01
- Inventor: Risa Miyazawa , Takahito Watanabe , Hiroyuki Mori , Keishi Okamoto
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Randall Bluestone
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/538 ; H01L21/48 ; H01L23/00 ; H01L21/683
Abstract:
An interconnection structure is disclosed. The interconnection structure includes a base substrate, a set of conductive pads disposed on the base substrate and an interconnection layer disposed on the base substrate. The interconnection layer has an edge located next to the set of the conductive pads and includes a set of side connection pads located and disposed at the edge of the interconnection layer. Each side connection pad is arranged with respect to a corresponding one of the conductive pads disposed on the base substrate.
Public/Granted literature
- US20210098349A1 INTERCONNECTION WITH SIDE CONNECTION TO SUBSTRATE Public/Granted day:2021-04-01
Information query
IPC分类:
