Invention Grant
- Patent Title: Clips for semiconductor package and related methods
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Application No.: US16677103Application Date: 2019-11-07
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Publication No.: US11264311B2Publication Date: 2022-03-01
- Inventor: Inpil Yoo , Seungwon Im , JooYang Eom , Jerome Teysseyre
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, Ltd.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00
Abstract:
Implementations of a clip may include a first copper layer directly bonded to a first side of a ceramic layer, a second copper layer directly bonded to a second side of the ceramic layer, the second side of the ceramic layer opposite the first side of the ceramic layer, and a plurality of channels partially etched into a thickness of the second copper layer.
Public/Granted literature
- US20210111104A1 CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS Public/Granted day:2021-04-15
Information query
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