Invention Grant
- Patent Title: Workpiece conveyance apparatus, semiconductor manufacturing apparatus, and workpiece conveyance method
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Application No.: US15769728Application Date: 2016-10-25
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Publication No.: US11264259B2Publication Date: 2022-03-01
- Inventor: Ryo Shimizu , Miki Sawai , Hirotaka Sazuka , Daisuke Ito
- Applicant: THE JAPAN STEEL WORKS, LTD.
- Applicant Address: JP Tokyo
- Assignee: THE JAPAN STEEL WORKS, LTD.
- Current Assignee: THE JAPAN STEEL WORKS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JPJP2015-211276 20151027
- International Application: PCT/JP2016/081617 WO 20161025
- International Announcement: WO2017/073573 WO 20170504
- Main IPC: H01L21/677
- IPC: H01L21/677 ; C03B25/093 ; C03B35/24 ; B23K26/354 ; B23K26/08 ; B65G51/03 ; C03B25/02 ; C03B35/00 ; H01L21/67 ; H01L21/683 ; C03B32/02 ; H01L21/02

Abstract:
A workpiece conveyance apparatus having: a conveyance path on which the workpiece moves; a gas flotation section that gas-floats the workpiece over the conveyance path; a movable holding section that holds the workpiece to move on the conveyance path along with the workpiece; and a treatment region conveyance path that is located on the conveyance path, and has a treatment region where predetermined treatment for the workpiece is performed, wherein the movable holding section has at least two or more holding sections along a movement direction of the conveyance path, each of the holding sections is capable of switching between release of holding and holding for the workpiece during movement of the workpiece, operation for releasing holding of the workpiece by the holding section on the treatment region conveyance path, and holding the workpiece on the conveyance path other than the treatment region conveyance path.
Public/Granted literature
- US20180315633A1 WORKPIECE CONVEYANCE APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND WORKPIECE CONVEYANCE METHOD Public/Granted day:2018-11-01
Information query
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