- Patent Title: Method for cleaning substrate and substrate processing apparatus
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Application No.: US16876291Application Date: 2020-05-18
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Publication No.: US11264233B2Publication Date: 2022-03-01
- Inventor: Kyo Otsubo , Hideaki Sakurai , Minako Inukai
- Applicant: KIOXIA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP2016-156720 20160809
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B3/04 ; B08B3/08 ; B08B7/00 ; B08B7/04 ; H01L21/67 ; G03F7/00

Abstract:
According to one embodiment, a method for cleaning a substrate includes first cleaning process and second cleaning process. The first cleaning process subjects a substrate to a first cleaning method. The second cleaning process subjects the substrate to a second cleaning method that is different from the first cleaning method and is subsequent to the first cleaning process. The first cleaning method includes at least one of acidic cleaning or alkaline cleaning. The second cleaning method includes freeze cleaning.
Public/Granted literature
- US20200279731A1 METHOD FOR CLEANING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2020-09-03
Information query
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