Disclosed herein are embodiments of methods that utilize dry adhesion tuning of a composite structure to adhere substrates. In some embodiments, the disclosed methods utilize dry adhesion between a composite structure and a substrate and further dynamically control the resulting dry adhesion strength through a heating step, which facilitates rigidity tuning of a core component of the composite structure and/or facilitates thermal control of the interface between the substrate and the composite structure. Also disclosed herein are array devices and other products comprising the disclosed composite structures.