Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US17001714Application Date: 2020-08-25
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Publication No.: US11260431B2Publication Date: 2022-03-01
- Inventor: Yukifumi Yoshida , Manabu Okutani , Shuichi Yasuda , Yasunori Kanematsu , Dai Ueda , Song Zhang , Tatsuro Nagahara , Takafumi Kinuta
- Applicant: SCREEN Holdings Co., Ltd. , Merck Patent GmbH
- Applicant Address: JP Kyoto; DE Darmstadt
- Assignee: SCREEN Holdings Co., Ltd.,Merck Patent GmbH
- Current Assignee: SCREEN Holdings Co., Ltd.,Merck Patent GmbH
- Current Assignee Address: JP Kyoto; DE Darmstadt
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2018-105630 20180531,JPJP2018-234734 20181214
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B7/00 ; B08B3/04 ; B08B3/08 ; B08B3/10 ; C11D3/20 ; C11D3/37
Abstract:
A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.
Information query
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