Invention Grant
- Patent Title: Electric component with sensitive component structures and method for producing an electric component with sensitive component structures
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Application No.: US15532454Application Date: 2015-10-19
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Publication No.: US11245977B2Publication Date: 2022-02-08
- Inventor: Christian Bauer , Hans Krüger , Jürgen Portmann , Alois Stelzl , Wolfgang Pahl
- Applicant: SNAPTRACK, INC.
- Applicant Address: US CA San Diego
- Assignee: SNAPTRACK, INC.
- Current Assignee: SNAPTRACK, INC.
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, LLP
- Priority: DE102014118214.6 20141209
- International Application: PCT/EP2015/074148 WO 20151019
- International Announcement: WO2016/091438 WO 20160616
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H04R1/22 ; H04R19/00 ; H04R31/00 ; H01L23/00 ; H04R19/04 ; B81C1/00 ; B81B7/00 ; H04R1/02 ; H04R1/06 ; H04R3/00 ; H04R23/02 ; H03H9/05 ; H01L21/56
Abstract:
The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.
Public/Granted literature
- US20170272855A1 SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRIC COMPONENT Public/Granted day:2017-09-21
Information query
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