An ear tip device for padding an in-ear headphone includes a cylinder, which comprises silicone and viscoelastic polyurethane foam so that the cylinder is resiliently compressible. A channel is axially positioned in and extends through the cylinder. The channel is configured to expand to allow insertion of a headphone and to contract to couple the cylinder to the headphone. The cylinder is configured to be compressed between digits of a hand of a user, positioning the user to at least partially insert the cylinder into an ear canal of the user. The cylinder is positioned to expand to conform to the ear canal and to couple the cylinder to the ear. The cylinder is configured to attenuate ambient noise and to direct a sound transmitted by the headphone to an eardrum of the user.