An image pickup apparatus which is capable of efficiently dispersing heat from a circuit board. A heating element is mounted on the circuit board. A heat transfer member made of a material with higher thermal conductivity than that of a chassis is disposed between the circuit board and the chassis in a direction of an optical axis. First connecting units support the circuit board and the heat transfer member in a stacked manner at a plurality of positions including two positions different from each other in a horizontal direction. A second connecting unit supports the heat transfer member. A third connecting unit supports an exterior member of the image pickup apparatus. Both the second connecting unit and the third connecting unit are provided between the two positions of the first connecting units in the horizontal direction.