Invention Grant
- Patent Title: Acoustic wave device with spinel layer and temperature compensation layer
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Application No.: US16923757Application Date: 2020-07-08
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Publication No.: US11245378B2Publication Date: 2022-02-08
- Inventor: Gong Bin Tang , Rei Goto , Hiroyuki Nakamura , Keiichi Maki
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US CA Irvine
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H03H9/02 ; H03H9/145 ; H03H9/64 ; H03H9/25 ; H03H9/72 ; H03F3/24

Abstract:
An acoustic wave device that includes a spinel layer, a piezoelectric layer, a temperature compensating layer between the spinel layer and the piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer is disclosed. The piezoelectric layer is disposed between the interdigital transducer electrode and the spinel layer. The acoustic wave device is configured to generate an acoustic wave having a wavelength of λ. The piezoelectric layer can have a thickness that is less than λ. In some embodiments, the spinel layer can be a polycrystalline spinel layer.
Public/Granted literature
- US20210067131A1 ACOUSTIC WAVE DEVICE WITH SPINEL LAYER AND TEMPERATURE COMPENSATION LAYER Public/Granted day:2021-03-04
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