Invention Grant
- Patent Title: Method of manufacturing flexible printed interconnect board
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Application No.: US16634640Application Date: 2018-07-26
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Publication No.: US11245237B2Publication Date: 2022-02-08
- Inventor: Yoshiro Adachi , Yoshifumi Uchita , Manabu Sudou , Yoshio Oka
- Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Shiga; JP Osaka
- Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Shiga; JP Osaka
- Agency: IPUSA, PLLC
- Priority: JPJP2017-156503 20170814
- International Application: PCT/JP2018/028088 WO 20180726
- International Announcement: WO2019/035334 WO 20190221
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H01R43/02 ; H01R12/57 ; H01R43/20 ; H05K3/00 ; H05K3/34
Abstract:
According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.
Public/Granted literature
- US20210044067A1 METHOD OF MANUFACTURING FLEXIBLE PRINTED INTERCONNECT BOARD Public/Granted day:2021-02-11
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