Invention Grant
- Patent Title: Chip antenna
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Application No.: US17002006Application Date: 2020-08-25
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Publication No.: US11245192B2Publication Date: 2022-02-08
- Inventor: Dae Ki Lim , Young Sik Hur , Kyu Bum Han , Ju Hyoung Park , Myeong Woo Han , Jeong Ki Ryoo
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2020-0040210 20200402
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/02 ; H01Q1/22

Abstract:
A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.
Public/Granted literature
- US20210313694A1 CHIP ANTENNA Public/Granted day:2021-10-07
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