Invention Grant
- Patent Title: Electrode assembly
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Application No.: US16222889Application Date: 2018-12-17
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Publication No.: US11245129B2Publication Date: 2022-02-08
- Inventor: Seongbong Cho , Jinpil Kim , Hyeonggu Roh , Kwanseop Song , Hyungnoh Jung
- Applicant: Samsung SDI Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2017-0174379 20171218
- Main IPC: H01M10/04
- IPC: H01M10/04 ; H01M50/20 ; H01M50/112 ; H01M50/103 ; H01M50/209 ; H01M50/46 ; H01M50/502 ; H01M50/529 ; H01M10/0525 ; H01M50/258

Abstract:
An electrode assembly includes a first sub-unit body including a plurality of stacked first unit bodies, and a second sub-unit body at a lower portion of the first sub-unit body and including a plurality of stacked first unit bodies and a second unit body at a lower portion of the first unit bodies, and each of the first unit bodies includes: first and second electrode plates of a first electrode separately arranged at a side of a first separator; a second separator on the first and second electrode plates of the first electrode; a first electrode plate of a second electrode arranged to correspond to the first electrode plate of the first electrode, with the first separator therebetween; and a second electrode plate of the second electrode arranged to correspond to the second electrode plate of the first electrode, with the second separator therebetween.
Public/Granted literature
- US20190189976A1 ELECTRODE ASSEMBLY Public/Granted day:2019-06-20
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