An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer. Subsequently, the first carrier substrate may be delaminated from the first release layer. The first release layer may then be removed from the first protective layer by dissolution in an electrolyte. The first protective layer may have a low mean peak to valley surface roughness and/or may be thin. In some embodiments, an interface between the first protective layer and the first electroactive material layer has a low mean peak to valley surface roughness. In some embodiments, a thickness of the first protective layer is greater than a mean peak to valley roughness of the first release layer. In some embodiments, an adhesive strength between the first release layer and the first protective layer is greater than an adhesive strength between the first release layer and the first carrier substrate.