Invention Grant
- Patent Title: Hall sensors with a three-dimensional structure
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Application No.: US16671613Application Date: 2019-11-01
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Publication No.: US11245067B2Publication Date: 2022-02-08
- Inventor: Ping Zheng , Bin Liu , Eng Huat Toh , Shyue Seng Tan , Ruchil Kumar Jain , Kiok Boone Elgin Quek
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: H01L43/06
- IPC: H01L43/06 ; H01L27/22 ; G01R33/00 ; H01L43/14

Abstract:
Structures for a Hall sensor and methods of forming a structure for a Hall sensor. The structure includes a semiconductor body having a top surface and a sloped sidewall defining a Hall surface that intersects the top surface. The structure further includes a well in the semiconductor body and multiple contacts in the semiconductor body. The well has a section positioned in part beneath the top surface and in part beneath the Hall surface. Each contact is coupled to the section of the well beneath the top surface of the semiconductor body.
Public/Granted literature
- US20210135095A1 HALL SENSORS WITH A THREE-DIMENSIONAL STRUCTURE Public/Granted day:2021-05-06
Information query
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