Invention Grant
- Patent Title: Wiring board and light emitting device
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Application No.: US16650998Application Date: 2018-09-25
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Publication No.: US11245059B2Publication Date: 2022-02-08
- Inventor: Akihito Kitagawa , Yoshiaki Itakura
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JPJP2017-185337 20170926
- International Application: PCT/JP2018/035459 WO 20180925
- International Announcement: WO2019/065633 WO 20190404
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/62

Abstract:
A wiring board includes a substrate for mounting a light emitting element; and a reflective film positioned on a surface of the substrate and reflecting light rays that are emitted from the light emitting element. The reflective film is formed of a plurality of adjacent columnar crystals extending in a perpendicular direction with respect to the surface of the substrate. A surface of the plurality of adjacent columnar crystals is in continuous at a surface of the reflective film.
Public/Granted literature
- US20200303606A1 WIRING BOARD AND LIGHT EMITTING DEVICE Public/Granted day:2020-09-24
Information query
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