A method of fabricating a micro light emitting diode (micro LED) apparatus includes forming a first substrate including a first silicon layer, a second silicon layer, and a silicon oxide layer sandwiched between the first silicon layer and the second silicon layer; forming a plurality of micro LEDs on a side of the second silicon layer distal to the silicon oxide layer; bonding the first substrate having the plurality of micro LEDs with a second substrate; and removing the silicon oxide layer and the first silicon layer.