Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US16739129Application Date: 2020-01-10
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Publication No.: US11245019B2Publication Date: 2022-02-08
- Inventor: Woo-Song Ahn , Sang-Don Yi , Yongchul Oh
- Applicant: XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Applicant Address: CN Qingdao
- Assignee: XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Current Assignee: XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Current Assignee Address: CN Qingdao
- Agency: ScienBiziP, P.C.
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/51 ; H01L29/66 ; H01L27/108 ; H01L49/02

Abstract:
A semiconductor device includes a substrate, a gate feature, a gate spacer, and a dielectric layer. The gate feature is above the substrate and includes a gate electrode. The gate spacer is on a sidewall of the gate feature. The dielectric layer is in contact with the gate spacer and has a larger thickness than the gate electrode.
Public/Granted literature
- US20210217867A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-07-15
Information query
IPC分类: