Invention Grant
- Patent Title: Silicon carbide trench semiconductor device
-
Application No.: US16779374Application Date: 2020-01-31
-
Publication No.: US11245016B2Publication Date: 2022-02-08
- Inventor: David Sheridan , Vipindas Pala , Madhur Bobde
- Applicant: Alpha and Omega Semiconductor (Cayman) Ltd.
- Applicant Address: KY Grand Cayman
- Assignee: Alpha and Omega Semiconductor (Cayman) Ltd.
- Current Assignee: Alpha and Omega Semiconductor (Cayman) Ltd.
- Current Assignee Address: KY Grand Cayman
- Agency: JDI Patent
- Agent Joshua Isenberg; Robert Pullman
- Main IPC: H01L21/04
- IPC: H01L21/04 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/16 ; H01L29/10 ; H01L29/08 ; H01L29/04 ; H01L29/36

Abstract:
A semiconductor apparatus has a silicon carbide substrate heavily doped with the first conductivity type and a lightly doped silicon carbide drift region of the first conductivity type over the silicon carbide substrate. A first body region in the drift region is doped with second conductivity type opposite the first. A first source region in the first body region is heavily doped with the first conductivity type. A gate trench is formed in the first source region and first body region. At least one sidewall of the gate trench is parallel to a crystal plane of the silicon carbide structure having greater carrier mobility than a C-face thereof. The gate trench extends a length of the first body region and the source region to a separation region laterally adjacent to the first region wherein the separation region is in the drift region.
Public/Granted literature
- US20210242319A1 SILICON CARBIDE TRENCH SEMICONDUCTOR DEVICE Public/Granted day:2021-08-05
Information query
IPC分类: