Invention Grant
- Patent Title: Method of transferring a thin film from a substrate to a flexible support
-
Application No.: US16797207Application Date: 2020-02-21
-
Publication No.: US11244971B2Publication Date: 2022-02-08
- Inventor: Laurent Michaud , Clement Castan , Frank Fournel , Pierre Montmeat
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1901735 20190221
- Main IPC: H01L27/12
- IPC: H01L27/12 ; C09J7/29 ; H01L21/02 ; H01L21/20
Abstract:
A method of transferring a thin film from a substrate to a flexible support that includes transfer of the flexible support by a layer of polymer, crosslinkable under ultraviolet light, directly on the thin film, the adhesion energy of the polymer evolving according to its degree of crosslinking, decreasing to an energy point d minimum adhesion achieved for a nominal crosslinking rate, then increasing for a crosslinking rate greater than the nominal crosslinking rate, then apply, on the polymer layer, an ultraviolet exposure parameterized so as to stiffen the polymer layer and have an adhesion energy between the thin film and the flexible support greater than an adhesion energy between the thin film and the substrate, then remove the substrate.
Public/Granted literature
- US20200350343A1 METHOD OF TRANSFERRING A THIN FILM FROM A SUBSTRATE TO A FLEXIBLE SUPPORT Public/Granted day:2020-11-05
Information query
IPC分类:
