Invention Grant
- Patent Title: Method of manufacturing light-emitting module
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Application No.: US17020838Application Date: 2020-09-15
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Publication No.: US11244935B2Publication Date: 2022-02-08
- Inventor: Takashi Ishii , Dai Wakamatsu , Hiroaki Kageyama
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JPJP2019-169177 20190918
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/075 ; H01L33/00

Abstract:
A method of manufacturing a light-emitting module that includes providing a light-transmissive member joined body that includes a plurality of submounts, a plurality of light-emitting elements each of which is disposed on a respective one of submounts, and a single light-transmissive member disposed on the light-emitting elements. The method further includes disposing the light-transmissive member joined body on a module board such that the submounts face the module board, forming a plurality of element structures by dividing the single light-transmissive member for each light-emitting element into the element structures each of which includes the submount, the light-emitting element, and the light-transmissive member positioned in this order, and forming a first covering member on the module board to cover lateral surfaces of the element structures.
Public/Granted literature
- US20210082885A1 METHOD OF MANUFACTURING LIGHT-EMITTING MODULE Public/Granted day:2021-03-18
Information query
IPC分类: