- Patent Title: Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin composition
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Application No.: US16761668Application Date: 2018-10-31
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Publication No.: US11244878B2Publication Date: 2022-02-08
- Inventor: Kyoko Nishidono , Takahiro Akashi
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2017-219228 20171114,JPJP2018-015698 20180131
- International Application: PCT/JP2018/040473 WO 20181031
- International Announcement: WO2019/098026 WO 20190523
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/00 ; H01L23/31 ; H01L23/544 ; H01L31/048 ; H01L51/52 ; H01L33/56 ; H01L33/52
Abstract:
A semiconductor-chip-encapsulating resin composition according to the present disclosure contains: an epoxy resin; a curing agent; and a low-valent titanium oxide, of which a titanium atom has an oxidation number less than +IV. A semiconductor package according to the present disclosure includes: a semiconductor chip; and an encapsulation resin which covers the semiconductor chip and which is a cured product of the semiconductor-chip-encapsulating resin composition.
Public/Granted literature
- US20210183719A1 SEMICONDUCTOR-CHIP-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTOR PACKAGE Public/Granted day:2021-06-17
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