Invention Grant
- Patent Title: System and method for determining hybrid-manufacturing process plans for printed circuit boards based on satisfiability modulo difference logic solver
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Application No.: US17023117Application Date: 2020-09-16
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Publication No.: US11244097B1Publication Date: 2022-02-08
- Inventor: Aleksandar B. Feldman , Morad Behandish , Johan de Kleer , Ion Matei , Saigopal Nelaturi
- Applicant: Palo Alto Research Center Incorporated
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Agent Shun Yao
- Main IPC: G06F30/337
- IPC: G06F30/337 ; G06F115/12 ; G06F7/24 ; G06F111/04

Abstract:
One embodiment can provide a system for determining a hybrid-manufacturing process plan for manufacturing a printed circuit board (PCB). During operation, the system can obtain a set of hybrid-manufacturing constraints. The set of hybrid-manufacturing constraints can include a set of primitives, a set of atoms, and an atom end-state vector. A primitive can represent an additive or a subtractive manufacturing process corresponding to one or more atoms of the PCB. An atom can correspond to a unit of spatial volume of the PCB. The system can determine a plurality of feasible hybrid-manufacturing plans based on the set of hybrid-manufacturing constraints. Each feasible hybrid-manufacturing plan can represent an ordering of the set of primitives satisfying the atom end-state vector. The system can determine costs for manufacturing the PCB using the plurality of feasible hybrid-manufacturing plans. The system can determine, based on the costs, an optimized hybrid-manufacturing plan for manufacturing the PCB.
Information query