Invention Grant
- Patent Title: Touch assembly with near-field communication circuit
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Application No.: US17316985Application Date: 2021-05-11
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Publication No.: US11243638B2Publication Date: 2022-02-08
- Inventor: Cheng-Tang Lin , Hsin-Lung Lin
- Applicant: Smart Approach CO., LTD.
- Applicant Address: TW Zhubei
- Assignee: Smart Approach CO., LTD.
- Current Assignee: Smart Approach CO., LTD.
- Current Assignee Address: TW Zhubei
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: CN202010413217.0 20200515
- Main IPC: G06F3/041
- IPC: G06F3/041 ; H04B5/00

Abstract:
A touch assembly with a near-field communication (NFC) circuit comprises a substrate, a touch circuit, an NFC circuit, and an antenna. The substrate has a surface layer and a radiation pattern layer. The surface layer has an antenna installation area. The antenna installation area has a center position. The radiation pattern layer is made of conductive material. An orthogonal projection of the radiation pattern layer on the surface layer overlaps with the antenna installation area. The orthogonal projection extends between an outer edge of the surface layer and the center position. The touch circuit is disposed on the substrate and outside of the antenna installation area. The NFC circuit is disposed on the substrate. There is a safe distance between the NFC circuit and the touch circuit. The antenna is disposed on the substrate. The antenna is located in the antenna installation area and above the radiation pattern layer.
Public/Granted literature
- US20210357069A1 TOUCH ASSEMBLY WITH NEAR-FIELD COMMUNICATION CIRCUIT Public/Granted day:2021-11-18
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