Invention Grant
- Patent Title: Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
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Application No.: US16210859Application Date: 2018-12-05
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Publication No.: US11241769B2Publication Date: 2022-02-08
- Inventor: David Masayuki Ishikawa , Jeonghoon Oh , Garrett Ho Yee Sin , Charles C. Garretson , Huanbo Zhang , Chia-Ling Pai , Niraj Prasad , Julio David Muzquiz
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: B24B37/32
- IPC: B24B37/32 ; B24B37/10 ; B24B57/02
Abstract:
A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
Public/Granted literature
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