Invention Grant
- Patent Title: Cutting tool including substrate and coating layer
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Application No.: US17254521Application Date: 2020-06-22
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Publication No.: US11241745B2Publication Date: 2022-02-08
- Inventor: Yasuki Kido , Anongsack Paseuth , Susumu Okuno
- Applicant: SUMITOMO ELECTRIC HARDMETAL CORP.
- Applicant Address: JP Itami
- Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.
- Current Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.
- Current Assignee Address: JP Itami
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JPJP2019-186818 20191010
- International Application: PCT/JP2020/024323 WO 20200622
- International Announcement: WO2021/070419 WO 20210415
- Main IPC: B23B27/14
- IPC: B23B27/14 ; C23C14/06 ; C23C16/30

Abstract:
A cutting tool comprises a substrate and a coating layer provided on the substrate, the coating layer including a multilayer structure layer composed of a first unit layer and a second unit layer, and a lone layer, the lone layer including cubic TizAl1-zN crystal grains, an atomic ratio z of Ti in the TizAl1-zN being 0.4 or more and less than 0.55, the lone layer having a thickness with an average value of 2.5 nm or more and 10 nm or less, the multilayer structure layer having a thickness with an average value of 40 nm or more and 95 nm or less, one multilayer structure layer and one lone layer forming a repetitive unit having a thickness with an average value of 50 nm to 100 nm, a maximum value of 90 nm to 110 nm, and a minimum value of 40 nm to 60 nm.
Public/Granted literature
- US20210237169A1 CUTTING TOOL Public/Granted day:2021-08-05
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