Invention Grant
- Patent Title: Cooking vessel with a thermal sensor
-
Application No.: US16707713Application Date: 2019-12-09
-
Publication No.: US11241113B2Publication Date: 2022-02-08
- Inventor: Stanley Kin Sui Cheng , Jonathan A. Jenkins , Darren Erik Vengroff
- Applicant: Meyer Intellectual Properties Ltd.
- Applicant Address: HK Kowloon
- Assignee: Meyer Intellectual Properties Ltd.
- Current Assignee: Meyer Intellectual Properties Ltd.
- Current Assignee Address: HK Kowloon
- Agency: Akerman LLP
- Main IPC: A47J27/00
- IPC: A47J27/00 ; A47J45/06 ; H05B6/06 ; A47J36/32 ; G01K1/14 ; G01K13/00

Abstract:
According to one example, a cookware apparatus includes a vessel. The vessel includes a bottom, and a sidewall surrounding the bottom and extending upward from the bottom so as to form a fluid retaining interior region. The sidewall terminates at a rim. The vessel also includes a channel extending through a portion of the bottom and further extending upward into and through a portion of the sidewall. The channel has an opening positioned in an external surface of the sidewall. The cookware apparatus further includes a thermal sensor positioned within the channel. The thermal sensor extends through the portion of the bottom and further extends upward into and through the portion of the sidewall.
Public/Granted literature
- US11122926B2 Cooking vessel with a thermal sensor Public/Granted day:2021-09-21
Information query