Invention Grant
- Patent Title: Component mounting apparatus
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Application No.: US16494243Application Date: 2017-03-22
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Publication No.: US11240950B2Publication Date: 2022-02-01
- Inventor: Kunimune Komaike
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Iwata
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Iwata
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2017/011380 WO 20170322
- International Announcement: WO2018/173137 WO 20180927
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/02 ; H05K13/04

Abstract:
The image including both of the component and the nozzle that is being lowered toward the component is captured. The target height at which the nozzle is stopped in the mounting process is controlled based on this image. This enables the target height at the time of lowering the nozzle toward the component to be controlled regardless of a flow rate of air sucked from the nozzle.
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