A camera module includes a lens driving device having a housing, a first circuit board disposed below the housing, a filter disposed on an upper surface of the first circuit board, a second circuit board disposed below the first circuit board, an image sensor disposed on the second circuit board and coupled to a lower surface of the first circuit board, and a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board, and electrically connecting the first circuit board and the second circuit board. A lower surface of the image sensor is higher than the upper surface of the second circuit board.