A method includes rendering a cleaning nozzle of a spin coating device below a base plate and out of optimal exposure to a bottom surface and edges of a substrate material placed on a spin chuck in a state of engagement of the base plate with the spin chuck, and rendering the base plate completely under the spin chuck even in the aforementioned state of engagement. In response to disengagement of a lid from the base plate, the method also includes disengaging the base plate from the spin chuck to lower the base plate to a locking point whereupon a portion of the cleaning nozzle below the base plate passes through a hole in the base plate and emerges completely out of and above the base plate, and cleaning the bottom surface and/or the edges of the substrate material utilizing the cleaning nozzle based on an optimal exposure thereof.