Invention Grant
- Patent Title: Coated wire
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Application No.: US16312703Application Date: 2017-08-18
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Publication No.: US11236430B2Publication Date: 2022-02-01
- Inventor: Yee Weon Lim , Xi Zhang , Senthil Kumar Balasubramanian , Suat Teng Tan , Jin Zhi Liao , Dan Su , Chee Wei Tok , Murali Sarangapani , Jurgen Scharf
- Applicant: Heraeus Materials Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Heraeus Materials Singapore Pte. Ltd.
- Current Assignee: Heraeus Materials Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Blank Rome LLP
- Priority: SG10201607523R 20160909
- International Application: PCT/SG2017/000008 WO 20170818
- International Announcement: WO2018/048344 WO 20180315
- Main IPC: C25D5/10
- IPC: C25D5/10 ; C25D3/46 ; C25D5/48 ; C25D7/06 ; H01B13/32 ; H01B13/02 ; H01B1/02

Abstract:
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1) silver in an amount in the range of from >99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to 89.49 to 99.497 wt.-%, (d2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to 200 to 1000 nm thick outer layer of gold.
Public/Granted literature
- US20210222313A1 COATED WIRE Public/Granted day:2021-07-22
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