Invention Grant
- Patent Title: Personalized copper block for selective solder removal
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Application No.: US16826226Application Date: 2020-03-21
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Publication No.: US11235404B2Publication Date: 2022-02-01
- Inventor: Charles L. Arvin , Luca Del Carro , Thomas Brunschwiler , Thomas Weiss , Chris Muzzy
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K1/018 ; B22F3/11 ; B23K3/08 ; B23K101/40
Abstract:
Disclosed are embodiments of forming porous copper on the end of a copper pillar. The embodiments may be used to remove solder from selected locations on a chip or laminate substrate.
Public/Granted literature
- US20210291287A1 PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL Public/Granted day:2021-09-23
Information query
IPC分类:
