Invention Grant
- Patent Title: PCB assembly structure for electronic appliance
-
Application No.: US16941008Application Date: 2020-07-28
-
Publication No.: US11224135B2Publication Date: 2022-01-11
- Inventor: Ho-Kweon Song , Hyunkyu Park , Eunbi Kang , Minsik Kim , Taeyoun Yoon , Dongjin Lee , Junsu Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey, LLP
- Priority: KR10-2019-0178365 20191230
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/02 ; H05K1/02

Abstract:
A PCB assembly includes a panel including at least one guide protrusion, at least one mounting portion, and at least one dislocation prevention protrusion, and a PCB including at least one guide hole formed to correspond to the at least one guide protrusion, at least one grounding portion formed to correspond to the at least one mounting portion, and at least one dislocation prevention hole formed to correspond to the at least one dislocation prevention protrusion, wherein the PCB is guided to slide by the at least one guide protrusion and the at least one guide hole, is brought into close contact with the panel by the at least one mounting portion and the at least one grounding portion, and fixed to the panel as the at least one dislocation prevention hole is supported by the at least one dislocation prevention protrusion.
Public/Granted literature
- US20210204425A1 PCB ASSEBLY STRUCTURE FOR ELECTRONIC APPLIANCE Public/Granted day:2021-07-01
Information query