Invention Grant
- Patent Title: Thermocouple, bonding tool for thermocouple, battery module, method for manufacturing thermocouple, and method for bonding thermocouple
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Application No.: US16770210Application Date: 2019-01-10
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Publication No.: US11223082B2Publication Date: 2022-01-11
- Inventor: Adrian Schiffer
- Applicant: Samsung SDI Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: EP18152264 20180118
- International Application: PCT/KR2019/000415 WO 20190110
- International Announcement: WO2019/143067 WO 20190725
- Main IPC: H01M10/6572
- IPC: H01M10/6572 ; G01K1/143 ; G01K7/04 ; H01L35/24 ; H01L35/32 ; H01L35/34 ; H01M10/48

Abstract:
A thermocouple for temperature measurement according to an embodiment may include a first wire of a first metallic material and a second wire of a second metallic material different from the first metallic material, a first section in which the first wire and the second wire are electrically insulated from each other, a second section in which the first wire and the second wire are connected to each other to form a measuring junction, a first layer of a thermally conductive and electrically insulating first material enclosing the second section, and a second layer of an ultrasonic-weldable second material enclosing at least part of the first layer.
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