Invention Grant
- Patent Title: Semiconductor wafer processing arrangement employing an adhesive sheet and method for processing a semiconductor wafer
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Application No.: US16773001Application Date: 2020-01-27
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Publication No.: US11222864B2Publication Date: 2022-01-11
- Inventor: Kevin Kwong-Tai Chung , Frederick Lo
- Applicant: Amerasia International Technology, Inc.
- Applicant Address: US NJ Princeton Junction
- Assignee: Amerasia International Technology, Inc.
- Current Assignee: Amerasia International Technology, Inc.
- Current Assignee Address: US NJ Princeton Junction
- Agency: Dann, Dorfman, Herrell & Skillman, PC
- Agent Clement A. Berard, Esq.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/687
Abstract:
A semiconductor wafer support arrangement and method for processing a semiconductor wafer including an adhesive sheet may comprise: a layer of wafer supporting adhesive that has certain characteristics that permit wafer processing, e.g., wafer thinning, and removal of the processed wafer in condition for use without cleaning. The carrier or substrate for the wafer processing may be reusable, and the adhesive sheet may have plural layers and may include a flexible substrate.
Public/Granted literature
- US20200243481A1 SEMICONDUCTOR WAFER PROCESSING SYSTEM AND METHOD Public/Granted day:2020-07-30
Information query
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