Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16723518Application Date: 2019-12-20
-
Publication No.: US11222827B2Publication Date: 2022-01-11
- Inventor: Hui Chang Moon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Main IPC: H01L27/1157
- IPC: H01L27/1157 ; H01L29/10 ; H01L29/792 ; H01L29/167 ; H01L29/66 ; H01L27/11582 ; H01L21/8234 ; H01L21/762 ; H01L21/02

Abstract:
A semiconductor device is provided. The semiconductor device includes a stack structure disposed on a lower structure; an insulating structure disposed on the stack structure; and a vertical structure extending in a direction perpendicular to an upper surface of the lower structure and having side surfaces opposing the stack structure and the insulating structure. The stack structure includes interlayer insulating layers and gate layers, alternately stacked, and the insulating structure includes a lower insulating layer, an intermediate insulating layer on the lower insulating layer, and an upper insulating layer on the intermediate insulating layer.
Public/Granted literature
- US20200312724A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-10-01
Information query
IPC分类: