Invention Grant
- Patent Title: Wafer processing method
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Application No.: US16781458Application Date: 2020-02-04
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Publication No.: US11222823B2Publication Date: 2022-01-11
- Inventor: Kazuma Sekiya
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JPJP2019-025978 20190215
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L21/268 ; B23K26/364 ; H01L21/68 ; H01L21/66 ; B32B37/10 ; B32B9/04
Abstract:
A wafer processing method for dividing a wafer into individual device chips. The wafer processing method includes a thermocompression bonding sheet providing step of positioning the wafer in an inside opening of a ring frame and providing a thermocompression bonding sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the thermocompression bonding sheet as applying a pressure to the thermocompression bonding sheet to thereby unite the wafer and the ring frame through the thermocompression bonding sheet by thermocompression bonding, a dividing step of cutting the wafer to thereby form a plurality of dividing grooves and dividing the wafer into the individual device chips, a flattening step of flattening the thermocompression bonding sheet, and a back side observing step of observing the back side of each device chip through the thermocompression bonding sheet.
Public/Granted literature
- US20200266103A1 WAFER PROCESSING METHOD Public/Granted day:2020-08-20
Information query
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