Invention Grant
- Patent Title: Tie bar removal for semiconductor device packaging
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Application No.: US16862027Application Date: 2020-04-29
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Publication No.: US11222790B2Publication Date: 2022-01-11
- Inventor: Richard Te Gan , Rushik Prabhudas Tank , Zhiwei Gong , Burton Jesse Carpenter , Jinmei Liu
- Applicant: NXP USA, INC.
- Applicant Address: US TX Austin
- Assignee: NXP USA, INC.
- Current Assignee: NXP USA, INC.
- Current Assignee Address: US TX Austin
- Priority: CN201911373697.6 20191226
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/495 ; H01L23/31 ; H01L21/56
Abstract:
A method of tie bar removal is provided. The method includes forming a leadframe including a tie bar and a flag. The tie bar extends from a side rail of the leadframe and has a distal portion at an angle different from a plane of the flag. A semiconductor die is attached to the flag of the leadframe. A molding compound encapsulates the semiconductor die, a portion of the leadframe, and the distal portion of the tie bar. The tie bar is separated from the molding compound with an angled cavity remaining in the molding compound.
Public/Granted literature
- US20210202267A1 TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING Public/Granted day:2021-07-01
Information query
IPC分类:
