Invention Grant
- Patent Title: Memory module with reduced ECC overhead and memory system
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Application No.: US16916463Application Date: 2020-06-30
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Publication No.: US11222709B2Publication Date: 2022-01-11
- Inventor: Taekwoon Kim , Wonhyung Song , Jangseok Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2020-0002393 20200108
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C29/42 ; G11C29/44 ; G11C29/32 ; G11C29/12

Abstract:
A memory system includes a memory module and a memory controller. The memory module includes data chips that store data and are assigned to a first sub-channel that generates a first code word or a second sub-channel that generates a second code word, where the first code word and the second code are used to fill a single cache line. The memory controller, upon detection of a hard-fail data chip among the data chips, copies data from the hard-fail data chip to the ECC chip, releases mapping between the hard-fail data chip and corresponding I/O, and defines new mapping between the ECC chip and the corresponding I/O pins.
Public/Granted literature
- US20210210156A1 MEMORY MODULE WITH REDUCED ECC OVERHEAD AND MEMORY SYSTEM Public/Granted day:2021-07-08
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