Invention Grant
- Patent Title: Flexible heat pipe cooled assembly
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Application No.: US16586119Application Date: 2019-09-27
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Publication No.: US11219140B2Publication Date: 2022-01-04
- Inventor: Karl-Heinz Fackler , Rainer Friedrich
- Applicant: Andrew Wireless Systems GmbH
- Applicant Address: DE Buchdorf
- Assignee: Andrew Wireless Systems GmbH
- Current Assignee: Andrew Wireless Systems GmbH
- Current Assignee Address: DE Buchdorf
- Agency: Fogg & Powers LLC
- Main IPC: H04B1/03
- IPC: H04B1/03 ; H05K7/20 ; F28D15/02 ; H03F3/20

Abstract:
In an example, a node of a telecommunications system includes a first section having one or more passive components; a second section including one or more power amplifier modules and a power supply, wherein the second section is coupled to the first section using fasteners; a distribution unit including a plate and a circuit board, wherein the second section is coupled to the distribution unit using fasteners; a cooling section; a first plurality of heat pipes extending from the one or more power amplifier modules to the cooling section; a second plurality of heat pipes extending from the first section into the second section; and a housing enclosing the first section and the second section.
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