Invention Grant
- Patent Title: Semiconductor device and semiconductor circuit
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Application No.: US16995039Application Date: 2020-08-17
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Publication No.: US11217686B2Publication Date: 2022-01-04
- Inventor: Tomoko Matsudai , Yoko Iwakaji
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Allen & Overy, LLP
- Priority: JPJP2020-050275 20200319
- Main IPC: H01L29/739
- IPC: H01L29/739

Abstract:
A semiconductor device according to an embodiment including: a semiconductor layer having a first plane and a second plane, the semiconductor layer including: a first trench on the first plane; a second trench on the second plane; a first conductivity first semiconductor region; a second conductivity type second semiconductor region between the first semiconductor region and the first plane; a first conductivity type third semiconductor region between the second semiconductor region and the first plane; a second conductivity type fourth semiconductor region between the third semiconductor region and the first plane; and a first conductivity type fifth semiconductor region provided between the second trench and the third semiconductor region in contact with the second trench; a first gate electrode in the first trench; a second gate electrode in the second trench; a first electrode on the first plane; and a second electrode on the second plane.
Public/Granted literature
- US20210296476A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CIRCUIT Public/Granted day:2021-09-23
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