Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
-
Application No.: US16584464Application Date: 2019-09-26
-
Publication No.: US11217677B2Publication Date: 2022-01-04
- Inventor: Byounghoon Lee , Jongho Park , Wandon Kim , Sangjin Hyun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2019-0027042 20190308
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L27/088 ; H01L29/78 ; H01L29/51 ; H01L21/28 ; H01L21/8234 ; H01L29/423 ; H01L29/66 ; H01L21/3215 ; H01L21/3115

Abstract:
A semiconductor device includes a substrate having first and second active regions, first and second active patterns on the first and second active regions, first and second gate electrodes running across the first and second active patterns, and a high-k dielectric layer between the first active pattern and the first gate electrode and between the second active pattern and the second gate electrode. The first gate electrode includes a work function metal pattern and an electrode pattern. The second gate electrode includes a first work function metal pattern, a second work function metal pattern, and an electrode pattern. The first work function metal pattern contains the same impurity as that of the high-k dielectric layer. An impurity concentration of the first work function metal pattern of the second gate electrode is greater than that of the work function metal pattern of the first gate electrode.
Public/Granted literature
- US20200287013A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2020-09-10
Information query
IPC分类: