Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16874812Application Date: 2020-05-15
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Publication No.: US11217673B2Publication Date: 2022-01-04
- Inventor: Deokhan Bae , Sungmin Kim , Juhun Park , Yoonyoung Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0124856 20191008
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/78 ; H01L27/092 ; H01L29/423 ; H01L29/786 ; H01L29/66 ; H01L29/06 ; H01L29/08 ; H01L21/02 ; H01L21/8238

Abstract:
A semiconductor device including: a substrate including a first active region; a first active pattern on the first active region; a gate electrode intersecting the first active pattern and extending in a first direction; a first source/drain pattern on the first active pattern, the first source/drain pattern adjacent to the gate electrode; a first interlayer insulating layer covering the gate electrode and the first source/drain pattern; and an active contact penetrating the first interlayer insulating layer to be electrically connected to the first source/drain pattern, wherein the active contact extends in the first direction, wherein a top surface of the active contact includes: a first protrusion; a second protrusion; and a first depression between the first and second protrusions.
Public/Granted literature
- US20210104612A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-04-08
Information query
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